BE Semiconductor

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Our mission is to deliver best-in-class tools, products and services to our customers and better members of the global semiconductor community.

Our vision is to be the innovative leader for growing and transforming our industry, striving for excellence in terms of quality, collaboration and growth.

BE Semiconductor has received numerous awards and honors over the years, including the Semicon West 2008 Diamond Award for Best Emerging Technology, the Silver Winner in Innovation Award at Automate 2017, and the 2020 BASA Award for Beloved Customer of the Year.