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BE Semiconductor

#1784

Rank

$9.49B

Marketcap

NL Netherlands

Country

BE Semiconductor
Leadership team

Mr. Richard W. Blickman (Chairman of Management Board, Pres & CEO)

Mr. Leon Verweijen (Sr. VP of Fin.)

Mr. Henk-Jan Jonge Poerink (Sr. VP of Global Operations)

Products/ Services
Electronics, Manufacturing, Marketing, Product Design, Semiconductor
Number of Employees
1,000 - 20,000
Headquarters
Duiven, Gelderland, The Netherlands
Established
1995
Net Income
100M - 500M
Revenue
500M - 1B
Traded as
BESI.AS
Social Media
Overview
Location
Summary
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
History

Established in 1982, BE Semiconductor is a global leader in the development and manufacturing of assembly and test equipment for the semiconductor industry. The company was known for its experience and engineering capabilities which led to the development of multiple innovative products that have revolutionised the industry. In 2007, BE Semiconductor was acquired by ASM International, a leading provider of materials and equipment needed to manufacture semiconductors.

Mission
Our mission is to deliver best-in-class tools, products and services to our customers and better members of the global semiconductor community.
Vision
Our vision is to be the innovative leader for growing and transforming our industry, striving for excellence in terms of quality, collaboration and growth.
Key Team

Mr. Ruurd Boomsma (Chief Technology Officer)

Mr. Peter Wiedner (Sr. VP of Sub Micron Die Attach)

Edmond Franco (VP of Corp. Devel.)

Mr. Jong Kwon Park (Sr. VP of Sales & Customer Support - APAC)

Mr. Rene W. Hendriks (Sr. VP of Sales - North America & Europe)

Mr. Jeroen Kleijburg (Sr. VP of Packaging)

Mr. Christoph Scheiring (Sr. VP of Die Attach)

Recognition and Awards
BE Semiconductor has received numerous awards and honors over the years, including the Semicon West 2008 Diamond Award for Best Emerging Technology, the Silver Winner in Innovation Award at Automate 2017, and the 2020 BASA Award for Beloved Customer of the Year.
References
BE Semiconductor
Leadership team

Mr. Richard W. Blickman (Chairman of Management Board, Pres & CEO)

Mr. Leon Verweijen (Sr. VP of Fin.)

Mr. Henk-Jan Jonge Poerink (Sr. VP of Global Operations)

Products/ Services
Electronics, Manufacturing, Marketing, Product Design, Semiconductor
Number of Employees
1,000 - 20,000
Headquarters
Duiven, Gelderland, The Netherlands
Established
1995
Net Income
100M - 500M
Revenue
500M - 1B
Traded as
BESI.AS
Social Media