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Winbond Electronics

Winbond Electronics
Leadership team

Mr. Yu-Cheng Chiao (Chairman & CEO)

Dr. Tung-Yi Chan Ph.D. (Vice Chairman & Deputy CEO)

Ms. Yung Chin (Chief Admin. Officer & Director)

Products/ Services
Electronics, Manufacturing
Number of Employees
1,000 - 20,000
Headquarters
Taichung, T'ai-wan, Taiwan
Established
1987
Net Income
500M - 1B
Revenue
Above - 1B
Traded as
TWSE:2344
Social Media
Overview
Location
Summary
Winbond Electronics Corporation designs, develops, manufactures, and markets very large scale integration integrated circuits (ICs) for various microelectronic applications in Asia, the Americas, Europe, and internationally. It operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. The company offers mobile dynamic random access memory (DRAM) devices, including pseudo static random access memory (SRAM), HyperRAM, low power SDR synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and known good die (KGD) products, as well as low power DDR1, DD2, DDR3, and DD4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and KGD products; code storage flash memory products comprising serial NOR flash, QspiNAND Flash, SLC NAND Flash, NAND Based MCP, SpiStack Flash NAND, TrustME secure flash memory products; and logic IC products. The company's products are used in computing, communication, and consumer electronics; automotive and industrial electronics; cell phones, tablets, low power mobile handheld devices, wearable devices, and Internet of things; and personal computers and their peripherals, mobile handheld devices and their peripheral modules, network communications products, consumer electronics, household appliance modules, etc. It markets its products through distributors and online. Further, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6 inch wafer products; electronic commerce; provision of test, OEM, and computer software services, as well as testing, and consulting services; and wholesale business for computer, supplements, and software, as well as project sale. The company was incorporated in 1987 and is headquartered in Taichung, Taiwan.
History

Winbond Electronics Corporation was founded in 1987 and its headquarters is located in Central Taiwan Science Park. They’ve become a major producer of semiconductor chips and are now known for their “Signature Memory” technology.

Mission
Winbond’s mission is to develop innovative memory solutions that help customers advance their products, improve their performance and simplify their design.
Vision
Winbond’s vision is to continually provide best-in-class memories and technology solutions that our customers can trust.
Key Team

Mr. Pei-Ming Chen (Pres & CTO)

Ms. Chin-Feng Yang (VP of Fin. Center, Chief Accounting Officer & Company Sec.)

Mr. Eungjoon Park (Chief Bus. Officer & Chief Strategy Officer)

Shui-Pao Wu (Chief Information Security Officer)

Dr. Keh-Shew Lu Ph.D. (Advisior)

Recognition and Awards
Winbond’s awards include Global Quality Awards from the Semiconductor Equipment and Materials International for the past eighteen consecutive years, multiple Electronics Sourcing Awards for their Signature Memory, and many others.
References

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Winbond Electronics
Leadership team

Mr. Yu-Cheng Chiao (Chairman & CEO)

Dr. Tung-Yi Chan Ph.D. (Vice Chairman & Deputy CEO)

Ms. Yung Chin (Chief Admin. Officer & Director)

Products/ Services
Electronics, Manufacturing
Number of Employees
1,000 - 20,000
Headquarters
Taichung, T'ai-wan, Taiwan
Established
1987
Net Income
500M - 1B
Revenue
Above - 1B
Traded as
TWSE:2344
Social Media